市場調查報告書
商品編碼
1042398

覆晶技術的全球市場(2021年∼2028年)

Global Flip Chip Technology Market - 2021-2028

出版日期: | 出版商: DataM Intelligence | 英文 180 Pages | 商品交期: 約2個工作天內

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  • 全貌
  • 簡介
  • 目錄
簡介

全球覆晶技術的市場規模在預測期間(2021年∼2028年)預計將以9.0%高年複合成長率成長。

本報告提供全球覆晶技術市場的相關調查,提供市場影響與機會,促進及阻礙因素,市場區隔·各地區的市場分析,競爭情形,主要企業的簡介等資訊。

目錄

第1章 覆晶技術市場調查手法和範圍

  • 調查手法
  • 調查的目的和調查範圍

第2章 覆晶技術市場:市場定義和概要

第3章 覆晶技術市場:摘要整理

  • 各產品類型的市場明細
  • 各凸塊技術的市場明細
  • 封裝技術的市場明細
  • 各終端用戶業界的市場明細
  • 各地區的市場明細

第4章 覆晶技術市場動態

  • 影響市場的要素
  • 促進因素
  • 阻礙因素
  • 影響分析
  • 市場機會

第5章 覆晶技術市場:產業分析

  • 波特的五力分析
  • 供應鏈分析
  • 法規分析
  • 價格分析

第6章 覆晶技術市場:各產品類型

  • 簡介
    • 市場規模分析,及與前一年同期比較成長分析
    • 市場魅力指數
  • 記憶體
  • CMOS影像感測器
  • SoC
  • GPU
  • CPU

第7章 覆晶技術市場:各凸塊技術

  • 簡介
    • 市場規模分析,及與前一年同期比較成長分析
    • 市場魅力指數
  • 錫鉛凸塊
  • 黃金凸塊(晶圓植球)
  • 其他

第8章 覆晶技術市場:封裝技術

  • 簡介
    • 市場規模分析,及與前一年同期比較成長分析
    • 市場魅力指數
  • 2D IC
  • 2.5D IC
  • 3D IC

第9章 覆晶技術市場:各終端用戶業界

  • 簡介
    • 市場規模分析,及與前一年同期比較成長分析
    • 市場魅力指數
  • 產業
  • 電子產品
  • IT·通訊
  • 航太·防衛
  • 汽車·運輸
  • 醫療保健
  • 其他

第10章 覆晶技術市場:各地區

  • 簡介
    • 市場規模分析,及與前一年同期比較成長分析
    • 市場魅力指數
  • 北美
  • 歐洲
  • 南美
  • 亞太地區
  • 中東和非洲

第11章 覆晶技術市場競爭情形

  • 競爭模式
  • 市場地位/佔有率分析
  • 合併和收購的分析

第12章 覆晶技術市場企業簡介

  • Taiwan Semiconductor Manufacturing Company Limited
  • Amkor Technology
  • Apple Inc.
  • 3M
  • Fujitsu Limited
  • International Business Machines Corporation
  • Samsung Electronics Co., Ltd.
  • Intel Corporation
  • Texas Instruments Incorporated
  • Advanced Micro Devices

第13章 覆晶技術市場:重要考察

第14章 覆晶技術市場:DataM

  • 附錄
  • 關於本公司·服務
  • 諮詢方式
目錄
Product Code: DM2502

Global Flip Chip Technology Market is segmented By Product Type (Memory, CMOS Image Sensor, SoC, GPU, CPU), By Bumping Technology (Solder Bumping, Gold Bumping, Others), By Packaging Technology (2D IC, 2.5D IC, 3D IC), By End-user Industry (Industrial, Electronics, IT & Telecommunication, Aerospace & Defense, Automotive & Transport, Healthcare, Others), and By Region (North America, Latin America, Europe, Asia Pacific, Middle East, and Africa) - Share, Size, Outlook, and Opportunity Analysis, 2021-2028

Market Overview

The Global Flip Chip Technology Market is expected to grow at a high CAGR of 9.0% during the forecasting period (2021-2028).

Why Purchase the Report?

Visualize the Flip Chip Technology Market products' composition across each product type and application, highlighting the critical commercial assets and players.

Identify commercial opportunities in the Flip Chip Technology Market by analyzing trends and co-development deals.

Comprehensive details on factors driving the market growth.

Excel data sheet with thousands of data points of Flip Chip Technology Market segmentation.

PDF report with the most relevant analysis cogently put together after exhaustive qualitative interviews and in-depth market study.

Target Audience

Industry Investors/Investment Bankers

Suppliers/Buyers

Education & Research Institutes

Manufacturers

Research Professionals

Emerging Companies

Distributors

Related Topic's 

System-on-Chip Market

Clip Applicator Market

Table of Contents

1. Flip Chip Technology Market Methodology and Scope

  • 1.1. Research Methodology
  • 1.2. Research Objective and Scope of the Report

2. Flip Chip Technology Market - Market Definition and Overview

3. Flip Chip Technology Market - Executive Summary

  • 3.1. Market Snippet by Product Type
  • 3.2. Market Snippet by Bumping Technology
  • 3.3. Market Snippet by Packaging Technology
  • 3.4. Market Snippet by End-user industry
  • 3.5. Market Snippet by Region

4. Flip Chip Technology Market Dynamics

  • 4.1. Market Impacting Factors
  • 4.2. Drivers
  • 4.3. Restraints
  • 4.4. Impact Analysis
  • 4.5. Opportunity

5. Flip Chip Technology Market - Industry Analysis

  • 5.1. Porter's Five Forces Analysis
  • 5.2. Supply Chain Analysis
  • 5.3. Regulatory Analysis
  • 5.4. Pricing Analysis

6. Flip Chip Technology Market - By Product Type

  • 6.1. Introduction
    • 6.1.1. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Product Type
    • 6.1.2. Market Attractiveness Index, By Product Type
  • 6.2. Memory
    • 6.2.1. Introduction
    • 6.2.2. Market Size Analysis, US$ Mn, 2020-2028 and Y-o-Y Growth Analysis (%), 2021-2028
  • 6.3. CMOS Image Sensor
  • 6.4. SoC
  • 6.5. GPU
  • 6.6. CPU

7. Flip Chip Technology Market - By Bumping Technology

  • 7.1. Introduction
    • 7.1.1. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Bumping Technology
    • 7.1.2. Market Attractiveness Index, By Bumping Technology
  • 7.2. Solder Bumping
    • 7.2.1. Introduction
    • 7.2.2. Market Size Analysis, USD Mn, 2020-2028 and Y-o-Y Growth Analysis (%), 2021-2028
  • 7.3. Gold Bumping
  • 7.4. Others

8. Flip Chip Technology Market - By Packaging Technology

  • 8.1. Introduction
    • 8.1.1. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Packaging Technology
    • 8.1.2. Market Attractiveness Index, By Packaging Technology
  • 8.2. 2D IC
    • 8.2.1. Introduction
    • 8.2.2. Market Size Analysis, USD Mn, 2020-2028 and Y-o-Y Growth Analysis (%), 2021-2028
  • 8.3. 2.5D IC
  • 8.4. 3D IC

9. Flip Chip Technology Market - By End-user industry

  • 9.1. Introduction
    • 9.1.1. Market Size Analysis, and Y-o-Y Growth Analysis (%), By End-user industry
    • 9.1.2. Market Attractiveness Index, By End-user industry
  • 9.2. Industrial
    • 9.2.1. Introduction
    • 9.2.2. Market Size Analysis, USD Mn, 2020-2028 and Y-o-Y Growth Analysis (%), 2021-2028
  • 9.3. Electronics
  • 9.4. IT & Telecommunication
  • 9.5. Aerospace & Defense
  • 9.6. Automotive & Transport
  • 9.7. Healthcare
  • 9.8. Others

10. Flip Chip Technology Market - By Region

  • 10.1. Introduction
    • 10.1.1. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Region
    • 10.1.2. Market Attractiveness Index, By Region
  • 10.2. North America
    • 10.2.1. Introduction
    • 10.2.2. Key Region-Specific Dynamics
    • 10.2.3. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Product Type
    • 10.2.4. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Packaging Technology
    • 10.2.5. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Bumping Technology
    • 10.2.6. Market Size Analysis, and Y-o-Y Growth Analysis (%), By End-user industries
    • 10.2.7. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Country
      • 10.2.7.1. The U.S.
      • 10.2.7.2. Canada
      • 10.2.7.3. Mexico
  • 10.3. Europe
    • 10.3.1. Introduction
    • 10.3.2. Key Region-Specific Dynamics
    • 10.3.3. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Product Type
    • 10.3.4. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Packaging Technology
    • 10.3.5. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Bumping Technology
    • 10.3.6. Market Size Analysis, and Y-o-Y Growth Analysis (%), By End-user industries
    • 10.3.7. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Country
      • 10.3.7.1. Germany
      • 10.3.7.2. The U.K.
      • 10.3.7.3. France
      • 10.3.7.4. Rest of Europe
  • 10.4. South America
    • 10.4.1. Introduction
    • 10.4.2. Key Region-Specific Dynamics
    • 10.4.3. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Product Type
    • 10.4.4. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Packaging Technology
    • 10.4.5. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Bumping Technology
    • 10.4.6. Market Size Analysis, and Y-o-Y Growth Analysis (%), By End-user industries
    • 10.4.7. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Country
      • 10.4.7.1. Brazil
      • 10.4.7.2. Argentina
      • 10.4.7.3. Rest of South America
  • 10.5. Asia Pacific
    • 10.5.1. Introduction
    • 10.5.2. Key Region-Specific Dynamics
    • 10.5.3. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Product Type
    • 10.5.4. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Packaging Technology
    • 10.5.5. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Bumping Technology
    • 10.5.6. Market Size Analysis, and Y-o-Y Growth Analysis (%), By End-user industries
    • 10.5.7. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Country
      • 10.5.7.1. China
      • 10.5.7.2. India
      • 10.5.7.3. Japan
      • 10.5.7.4. Australia
      • 10.5.7.5. Rest of Asia Pacific
  • 10.6. The Middle East and Africa
    • 10.6.1. Introduction
    • 10.6.2. Key Region-Specific Dynamics
    • 10.6.3. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Product Type
    • 10.6.4. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Packaging Technology
    • 10.6.5. Market Size Analysis, and Y-o-Y Growth Analysis (%), By Bumping Technology
    • 10.6.6. Market Size Analysis, and Y-o-Y Growth Analysis (%), By End-user industries

11. Flip Chip Technology Market Competitive Landscape

  • 11.1. Competitive Scenario
  • 11.2. Market Positioning/Share Analysis
  • 11.3. Mergers and Acquisitions Analysis

12. Flip Chip Technology Market Company Profiles

  • 12.1. Taiwan Semiconductor Manufacturing Company Limited
    • 12.1.1. Company Overview
    • 12.1.2. Form Portfolio and Description
    • 12.1.3. Key Highlights
    • 12.1.4. Financial Overview
  • 12.2. Amkor Technology
  • 12.3. Apple Inc.
  • 12.4. 3M
  • 12.5. Fujitsu Limited
  • 12.6. International Business Machines Corporation
  • 12.7. Samsung Electronics Co., Ltd.
  • 12.8. Intel Corporation
  • 12.9. Texas Instruments Incorporated
  • 12.10. Advanced Micro Devices (*List Is Not Exhaustive)

13. Flip Chip Technology Market - Premium Insights

14. Flip Chip Technology Market - DataM

  • 14.1. Appendix
  • 14.2. About Us and Services
  • 14.3. Contact Us