2024 CMC Conference Agenda
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| 第0天 - 2024年4月9日 | |||
| 3:00 PM | Conference Check-In | ||
| 6:00 PM | Welcome Reception at 6PM | ||
| 第1天 - 2024年4月10日 | |||
| 7:15 AM | Breakfast sponsored by NY CREATES | ||
| 8:00 AM | Welcome and Opening Remarks Karey Holland, TECHCET and Alan Balderson, Kanto Kevin Hartke, Mayor of Chandler, AZ |
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| 8:15 AM | Keynote Speech: Pavel Freundlich, Ph.D., CTO & VP, Power Solutions Group - onsemi “Revolutionizing Power Semiconductors: The Rise of Wide Bandgap Materials” |
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| 9:00 AM | Session I: Global Issues & Trends Impacting Materials Session Chairs: Jeff Hemphill - Intel and Jeff Loewecke - Texas Instruments |
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| Time | Speaker | Topic | |
| 9:05 AM | Scott Jones, Managing Director - Alvarez & Marsal | Semiconductor Industry and M&A Outlook | |
| 9:35 AM | Jeff Perkins, Executive Vice President and General Manager - Yole | More Than Moore Megatrends Beyond Silicon | |
| 10:05 AM | Lita Shon-Roy, President and CEO - TECHCET | The Semiconductor Market & Supply Chain Resilience | |
| 10:35 AM | Coffee Break sponsored by Edwards | ||
| 10:50 AM | Tyler Scott, Sr. Manager Global Sourcing - onsemi | Best Practices on Management Materials Across Borders - How Do You Deal with Different Fabs Located in Different Countries. Local vs. Global Supply Chain | |
| 11:20 AM | Dan Alvarez, Ph.D., Founder and CEO - Purity ReSource | Improving the Environmental Impact of Semiconductor Materials | |
| 11:50 AM | Rob Rhoades, Ph.D, Co-Founder, President, & CEO - X-Trinsic | SiC Wafering Processes from 150 to 200mm: An Evolution | |
| 12:20 PM | Lunch sponsored by Applied Materials | ||
| 1:20 PM | Session II: Heterogenous Integration & Advanced Packaging Materials Session Chairs: Jim Hannah - SEH America and Paul Werbaneth |
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| 1:25 PM | Session Keynote: Dilan Seneviratne, Ph.D, Principal Engineer - Intel | Glass Substrates for Advanced Packaging | |
| 2:10 PM | Jun-Ro Yoon, Ph.D, TGV Program Manager - Corning | Materials Supply Perspective: Glass for Advanced Packaging | |
| 2:40 PM | Coffee Break sponsored by Linde | ||
| 2:55 PM | Jeb Flemming, Founder and CTO - 3D Glass Solutions | Glass Devices for Next Generation Packaging and Rf Signal Conditioning | |
| 3:25 PM | Andy Mackie, Ph.D, Principal Engineer, Advanced Materials - Indium Corporation | From SiP to SiC: Advanced Metal Alloys meet Evolving Reliability Challenges | |
| 3:55 PM | Abdelhamid ElSawy, Ph.D, Sr. Research and Development Scientist - MacDermid Alpha | Advancements in Hybrid Bonding: Engineering Grain Boundaries for Enhanced Microelectronic Device Assembly | |
| 4:25 PM | Lihong Cao, Ph.D, Sr. Director, Engineering/Technical Marketing - ASE Group | Material Requirements for Advanced Packaging and Heterogeneous Integration | |
| 5:30 PM | “Not-So-Usual” Roundtable Networking Event with Beer Tasting and Trivia! - Come meet Speakers and Discuss Hot Topics! |
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| 第2天 - 2024年4月11日 | |||
| 7:15 AM | Breakfast | ||
| 8:05 AM | Day 2 Keynote: David Thompson, Ph.D., VP, Process Engineering, Components Research - Intel “The Future of Materials for Leading Edge Devices” |
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| 8:40 AM | Session III: Immediate Challenges of Materials and Manufacturing Session Chairs: Rachel Ren - Edwards and Nathan Cline - NXP |
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| 8:45 AM | Adam Schafer, Ph.D, Head of Supply Chain Strategy - US CHIPS Program Office | CHIPS Program Overview for the Semiconductor Manufacturing Supply Chain | |
| 9:10 AM | Dawn Graunke, Supply Chain Sustainability Regulatory Manager - Intel | PFAS Concerns on the Semiconductor Industry | |
| 9:35 AM | Adam Paul, Sr. Director, WW Procurement - Analog Devices | Needing More for Less - IDM Asks & Concerns for Material Suppliers | |
| 10:00 AM | Coffee Break | ||
| 10:15 AM | Jeffrey Yoder, Ph.D, Sr. Director HVM Product Management - Air Liquide | Commercialization of MoO2Cl2 for Advanced Node Applications | |
| 10:40 AM | Pawitter Mangat, Ph.D, Sr. Director, Global Supplier Quality & Material Engineering - GlobalFoundries | Materials & HV Manufacturing in the AI Era - Foundry Perspective | |
| 11:05 AM | Session IV: Challenges of Equipment & Consumable Component Materials Session Chairs: David Lee - Coorstek and Dalia Vernikovsky - ASNA |
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| 11:10 AM | Session Keynote: George Alajajian, Ph.D, VP, Strategic Parts Supply Chain - Intel | Fab Equipment Component Supply Chain - Evolution Continues | |
| 11:35 AM | Alexander Kaiser, Global Product Manager - Edwards Vacuum | Process Control Challenges and Approaches for Next Generation Semiconductor Devices and Materials | |
| 12:00 PM | Lunch | ||
| 1:00 PM | Bhavya Vaidya, VP Supply Chain - LAM Research | Supply Chain Sourcing Flexibility | |
| 1:25 PM | Trace Hurd, Ph.D, Sr. Director, Technology Development - Tokyo Electron | Sustainable Materials Strategies For Semiconductor Manufacturing | |
| 1:50 PM | James Hamzik, Sr. Manager, Membrane R&D - Entegris | Challenges in the Purification of Acids and Bases to Achieve Sub-ppt Cleanliness Levels | |
| 2:15 PM | Coffee Break | ||
| 2:30 PM | Session V: Emerging Materials in R&D and Pilot Fabrication Session Chairs: Steve Consiglio - TEL and Nicolas Blasco - Air Liquide |
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| 2:35 PM | Karl Robinson, Ph.D, Sr. Manager Key Account Technology - ASM | GAA to CFET - PEALD Challenges | |
| 3:00 PM | Eric Joseph, Ph.D., Sr. Manager, Master Inventor, and Principal Research Staff Member, Advanced Materials and Process - IBM | Plasma Processing and the Semiconductor Supply Chain in an Era of Low GWP and/or PFAS-Free Gas Chemistries |
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| 3:25 PM | Satyavolu Papa Rao, Ph.D, VP for Research - NY CREATES | Materials Challenges for Quantum Computing | |
| 3:50 PM | Stefan Müller, Ph.D, CTO - Ferroelectric Memory Company | Ferroelectric Hafnium Oxide for Memory Cells: Manufacturing Aspects | |
| 4:15 PM | Karey Holland, Ph.D, Chief Strategist - TECHCET | Advanced Technologies Roadmaps and Implications to Precursor Materials | |
* 活動內容有可能不事先告知作更動及調整。
